GE Fanuc Emerson - IC694ACC310 Filler Module
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Venditore:
General Electric
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Tipo:
Filler Module
- Tags Filler module , I/o filler module
Informazioni sul prodotto
Key Features & Specifications:
Module Type: Blank Slot Filler (Dummy Module)
PartNumber: IC694ACC310
Backplane Current Draw: 0 A (no power consumption)
Compatibility: Works with all RX3i PACSystem CPUs and baseplates
Slot Coverage: Single Slot
Installation: Hot-swappable, safe to insert or remove while powered
Environmental Protection: Water, oil, dust, and metal debris resistant
Material: Same industrial-grade thermoplastic as I/O modules
Weight: Approx. 180 grams (±10%)
Dimensions (W x H x D): 35 mm x 170 mm x 130 mm
Status Indicators: None (no LED lights)
Programming Required: No
Compatible Baseplates: Main (7, 12, 16-slot), Expansion (5, 10-slot)
System Type: PCI-based rack system with Profinet and PacMotion support
Lifespan / Shelf Life: 1 year from installation under standard conditions
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- Custom Calibration: Provide your specifications, and we’ll handle the rest with precision.

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