GE Fanuc - Modul Induk DeviceNet IC694DNM200
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Vendor:
General Electric
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Type:
Modul Induk DeviceNet
- Tags Devicenet master module
About the Product
Temui IC694 DNM200 (Modul Master DeviceNet), direka untuk platform PACSystem RX3i dan Siri 90‑30. Modul ini membolehkan komunikasi lancar dengan sehingga 63 hamba DeviceNet dan menyokong pertukaran data yang kukuh sebanyak 255 Byte input dan 255 Byte output setiap nod.
Suffix Model: DNM200
Port:
1 × port servis RS‑232
1 × port Master DeviceNet
Kadar Komunikasi: 125 kbaud, 250 kbaud, atau 500 kbaud
Kapasiti Maks I/O: Sehingga 3 972 Byte input & 3 972 Byte output (jumlah)
Sokongan Topologi: Trunkline ≤ 500 m; Dropline ≤ 6 m
Kuasa: 450 mA @ 5 VDC (2.25 W tipikal), dikuasakan oleh backplane
Dimensi: 127 mm × 32 mm × 102 mm
Berat: 0.15 kg
Temp Operasi: –25 °C hingga +70 °C
Temp Penyimpanan: –40 °C hingga +85 °C
MTBF: ~200 000 jam
CPU Disokong: RX3i v3.5 atau lebih baru
Jenis Sambungan: Polled, Cyclic, Strobe, COS, UCMM (1 proksi per hamba)
Jaminan: Sah untuk satu tahun
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- Warranty: NexAuto offers a 12-month warranty on all parts purchased from us, in addition to any manufacturer coverage.
- Returns: 30-day return policy for defective or mismatched parts, ensuring peace of mind.
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- Custom Calibration: Provide your specifications, and we’ll handle the rest with precision.

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