GE Fanuc Emerson - IC694ACC310 Dolgu Modülü
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Satıcı:
General Electric
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Tip:
Doldurucu Modül
- Tags Filler module , I/o filler module
Ürün Hakkında
Ana Özellikler ve Teknik Özellikler:
Modül Türü: Boş Yuvası Doldurucu (Sahte Modül)
Parça Numarası: IC694ACC310
Backplane Akım Çekişi: 0 A (güç tüketimi yok)
Uyumluluk: Tüm RX3i PACSystem CPU'ları ve taban plakaları ile uyumludur
Yuva Kapsamı: Tek Yuva
Kurulum: Sıcak takılabilir, güç açıkken güvenle takılıp çıkarılabilir
Çevresel Koruma: Su, yağ, toz ve metal parçacıklarına dayanıklı
Malzeme: I/O modülleri ile aynı endüstriyel sınıf termoplastik
Ağırlık: Yaklaşık 180 gram (±%10)
Boyutlar (G x Y x D): 35 mm x 170 mm x 130 mm
Durum Göstergeleri: Yok (LED ışık yok)
Programlama Gerekiyor mu: Hayır
Uyumlu Taban Plakaları: Ana (7, 12, 16 yuvalı), Genişletme (5, 10 yuvalı)
Sistem Türü: Profinet ve PacMotion destekli PCI tabanlı raf sistemi
Ömür / Raf Ömrü: Standart koşullar altında kurulumdan itibaren 1 yıl
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